| MRC |
Requirement Statement |
Characteristics |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
7.0 VOLTS MAXIMUM POWER SOURCE |
| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
1.0 WATTS |
| AFGA |
OPERATING TEMP RANGE |
-0.0 TO 70.0 DEG CELSIUS |
| ADAU |
BODY HEIGHT |
0.180 INCHES NOMINAL |
| CZEQ |
TIME RATING PER CHACTERISTIC |
450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CQZP |
INPUT CIRCUIT PATTERN |
16 INPUT |
| TEST |
TEST DATA DOCUMENT |
16331-63A133445 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| CQWX |
OUTPUT LOGIC FORM |
N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| TTQY |
TERMINAL TYPE AND QUANTITY |
22 PRINTED CIRCUIT |
| ADAQ |
BODY LENGTH |
1.100 INCHES MAXIMUM |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND W/ENABLE AND 3-STATE OUTPUT |
| CRHL |
(NON-CORE DATA) BIT QUANTITY |
1024 |
| CZER |
MEMORY DEVICE TYPE |
RAM |
| CSWJ |
(NON-CORE DATA) WORD QUANTITY |
256 |
| ADAT |
BODY WIDTH |
0.400 INCHES NOMINAL |
