| MRC |
Requirement Statement |
Characteristics |
| CZEQ |
TIME RATING PER CHACTERISTIC |
90.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 90.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| CQZP |
INPUT CIRCUIT PATTERN |
13 INPUT |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-0.5 VOLTS MINIMUM POWER SOURCE AND 7.5 VOLTS MAXIMUM POWER SOURCE |
| AGAV |
III END ITEM IDENTIFICATION |
AN/BPS14TO15E |
| CZZZ |
MEMORY CAPACITY |
UNKNOWN |
| ADAT |
BODY WIDTH |
0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| TTQY |
TERMINAL TYPE AND QUANTITY |
24 PRINTED CIRCUIT |
| ADAU |
BODY HEIGHT |
0.210 INCHES MAXIMUM |
| CRHL |
(NON-CORE DATA) BIT QUANTITY |
4096 |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
1.02 WATTS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CSWJ |
(NON-CORE DATA) WORD QUANTITY |
512 |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND SCHOTTKY AND BIPOLAR |
| ADAQ |
BODY LENGTH |
1.290 INCHES MAXIMUM |
| CZER |
MEMORY DEVICE TYPE |
ROM |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
D-3 MIL-M-38510 |
