| MRC |
Requirement Statement |
Characteristics |
| CZEQ |
TIME RATING PER CHACTERISTIC |
48.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 48.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND LOW POWER AND MEDIUM SPEED |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| PRMT |
III PRECIOUS MATERIAL |
GOLD |
| PMLC |
III PRECIOUS MATERIAL AND LOCATION |
TERMINALS GOLD |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
132.0 MILLIWATTS |
| CQWX |
OUTPUT LOGIC FORM |
DIODE-TRANSISTOR LOGIC |
| AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
| ADAQ |
BODY LENGTH |
0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| CQZP |
INPUT CIRCUIT PATTERN |
HEX 1 INPUT |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| CWSG |
TERMINAL SURFACE TREATMENT |
GOLD |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
6 GATE, NAND |
| ADAU |
BODY HEIGHT |
0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM |
| ADAT |
BODY WIDTH |
0.120 INCHES MINIMUM AND 0.150 INCHES MAXIMUM |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
T0-84 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
