| MRC |
Requirement Statement |
Characteristics |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
40.0 MILLIWATTS |
| CZEQ |
TIME RATING PER CHACTERISTIC |
22.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
4 GATE, NAND |
| TTQY |
TERMINAL TYPE AND QUANTITY |
14 FLAT LEADS |
| CQZP |
INPUT CIRCUIT PATTERN |
QUAD 2 INPUT |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/TOTEM POLE OUTPUT |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| ADAT |
BODY WIDTH |
0.235 INCHES MINIMUM AND 0.265 INCHES MAXIMUM |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| ADAQ |
BODY LENGTH |
0.337 INCHES MINIMUM AND 0.350 INCHES MAXIMUM |
| ADAU |
BODY HEIGHT |
0.055 INCHES MINIMUM AND 0.085 INCHES MAXIMUM |
| AFGA |
OPERATING TEMP RANGE |
0.0 TO 70.0 DEG CELSIUS |
