| MRC |
Requirement Statement |
Characteristics |
| CQZP |
INPUT CIRCUIT PATTERN |
2 INPUT |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
T0-91 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-22.0 VOLTS MINIMUM POWER SOURCE AND 22.0 VOLTS MAXIMUM POWER SOURCE |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 AMPLIFIER, OPERATIONAL, GENERAL PURPOSE |
| ADAT |
BODY WIDTH |
0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| CBBL |
FEATURES PROVIDED |
MONOLITHIC AND POSITIVE OUTPUTS |
| ADAQ |
BODY LENGTH |
0.240 INCHES MINIMUM AND 0.290 INCHES MAXIMUM |
| ADAU |
BODY HEIGHT |
0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
500.0 MILLIWATTS |
| TTQY |
TERMINAL TYPE AND QUANTITY |
10 FLAT LEADS |
