| MRC |
Requirement Statement |
Characteristics |
| CQZP |
INPUT CIRCUIT PATTERN |
DUAL 3 INPUT |
| TTQY |
TERMINAL TYPE AND QUANTITY |
10 PIN |
| CQSZ |
INCLOSURE CONFIGURATION |
CAN |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-2.0 VOLTS MINIMUM POWER SOURCE AND 4.0 VOLTS MAXIMUM POWER SOURCE |
| ADAR |
BODY OUTSIDE DIAMETER |
0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
| AFGA |
OPERATING TEMP RANGE |
0.0 TO 75.0 DEG CELSIUS |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
2 GATE, NAND-NOR |
| CQWX |
OUTPUT LOGIC FORM |
DIODE-TRANSISTOR LOGIC |
| CZEQ |
TIME RATING PER CHACTERISTIC |
30.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| ADAU |
BODY HEIGHT |
0.180 INCHES MAXIMUM |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND LOW POWER AND POSITIVE OUTPUTS |
| CQSJ |
INCLOSURE MATERIAL |
GLASS AND METAL |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 175.0 DEG CELSIUS |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
30.0 MILLIWATTS |
