| MRC |
Requirement Statement |
Characteristics |
| CBBL |
FEATURES PROVIDED |
MONOLITHIC AND HERMETICALLY SEALED AND HIGH GAIN AND LOW POWER AND LOW LEVEL AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND EXTERNALLY COMPENSATED |
| CZEQ |
TIME RATING PER CHACTERISTIC |
1000.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
T0-91 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CQZP |
INPUT CIRCUIT PATTERN |
4 INPUT |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| PRMT |
III PRECIOUS MATERIAL |
GOLD |
| PMLC |
III PRECIOUS MATERIAL AND LOCATION |
TERMINALS GOLD |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
570.0 MILLIWATTS |
| AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
| ADAQ |
BODY LENGTH |
0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| ADAU |
BODY HEIGHT |
0.050 INCHES MINIMUM AND 0.065 INCHES MAXIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| CWSG |
TERMINAL SURFACE TREATMENT |
GOLD |
| ADAT |
BODY WIDTH |
0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
