| MRC |
Requirement Statement |
Characteristics |
| CQSZ |
INCLOSURE CONFIGURATION |
CAN |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
T0-99 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CQZP |
INPUT CIRCUIT PATTERN |
4 INPUT |
| ADAR |
BODY OUTSIDE DIAMETER |
0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
| PRMT |
III PRECIOUS MATERIAL |
GOLD |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| TTQY |
TERMINAL TYPE AND QUANTITY |
8 PIN |
| PMLC |
III PRECIOUS MATERIAL AND LOCATION |
TERMINAL SURFACE GOLD |
| CZEQ |
TIME RATING PER CHACTERISTIC |
10000.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
22.0 VOLTS MAXIMUM POWER SOURCE |
| AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 AMPLIFIER, OPERATIONAL, GENERAL PURPOSE |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND ADJUSTABLE |
| ADAU |
BODY HEIGHT |
0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
500.0 MILLIWATTS |
| CQSJ |
INCLOSURE MATERIAL |
GLASS AND METAL |
