| MRC |
Requirement Statement |
Characteristics |
| TTQY |
TERMINAL TYPE AND QUANTITY |
2 BONDING PAD |
| CQBQ |
CAPACITANCE VALUE PER SECTION |
22.000 PICOFARADS SINGLE SECTION |
| ABPM |
BODY DIAMETER |
0.380 INCHES MAXIMUM |
| ADAQ |
BODY LENGTH |
0.156 INCHES MAXIMUM |
| CRTP |
TOLERANCE RANGE PER SECTION |
-10.00 TO 10.00 PERCENT SINGLE SECTION |
| ABMK |
(NON-CORE DATA) OVERALL WIDTH |
0.380 INCHES MAXIMUM |
| CWJK |
CASE MATERIAL |
CERAMIC |
| AARG |
RELIABILITY INDICATOR |
NOT ESTABLISHED |
| CQLZ |
TEMP COEFFICIENT OF CAPACITANCE PER SECTION IN PPM PER DEG CELSIUS |
-330.0 SINGLE SECTION |
| ABKW |
(NON-CORE DATA) OVERALL HEIGHT |
0.380 INCHES MAXIMUM |
| ABHP |
(NON-CORE DATA) OVERALL LENGTH |
0.156 INCHES MAXIMUM |
| CWPK |
INSULATION RESISTANCE AT REFERENCE TEMP |
7500.0 MEGOHMS |
| CQWM |
NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION |
500.0 DC SINGLE SECTION |
| CQJJ |
NONDERATED OPERATING TEMP |
-55.0 DEG CELSIUS MINIMUM AND 85.0 DEG CELSIUS MAXIMUM |
| AEBZ |
SCHEMATIC DIAGRAM DESIGNATOR |
NO COMMON OR GROUNDED ELECTRODE(S) |
| CWSG |
III TERMINAL SURFACE TREATMENT |
SOLDER |
| AAQL |
BODY STYLE |
CHIP TYPE |
| CRHD |
TOLERANCE OF TEMP COEFFICIENT PER SECTION IN PPM PER DEG CELSIUS |
-60.0 TO 60.0 SINGLE SECTION |
