| MRC |
Requirement Statement |
Characteristics |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
T0-86 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| TTQY |
TERMINAL TYPE AND QUANTITY |
14 FLAT LEADS |
| TEST |
TEST DATA DOCUMENT |
88818-C528000251 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 FLIP-FLOP, J-K/R-S, CLOCKED, MASTER SLAVE |
| CZEQ |
TIME RATING PER CHACTERISTIC |
65.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
81.0 MILLIWATTS |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| PRMT |
III PRECIOUS MATERIAL |
GOLD |
| PMLC |
III PRECIOUS MATERIAL AND LOCATION |
TERMINALS GOLD |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| CQWX |
OUTPUT LOGIC FORM |
DIODE-TRANSISTOR LOGIC |
| AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| CWSG |
TERMINAL SURFACE TREATMENT |
GOLD |
| ADAQ |
BODY LENGTH |
0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM |
| ADAT |
BODY WIDTH |
0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| CQZP |
INPUT CIRCUIT PATTERN |
7 INPUT |
| ADAU |
BODY HEIGHT |
0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND EDGE TRIGGERED AND ASYNCHRONOUS AND RESETTABLE AND W/CLEAR AND W/CLEAR AND W/BUFFERED OUTPUT |
