| MRC |
Requirement Statement |
Characteristics |
| TTQY |
TERMINAL TYPE AND QUANTITY |
10 PIN |
| CQSZ |
INCLOSURE CONFIGURATION |
CAN |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND ASYNCHRONOUS AND EDGE TRIGGERED AND POSITIVE OUTPUTS AND RESETTABLE AND SYNCHRONOUS AND W/CLEAR |
| CQZP |
INPUT CIRCUIT PATTERN |
6 INPUT |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 FLIP-FLOP, J-K/R-S, CLOCKED, MASTER SLAVE AND 1 FLIP-FLOP, PULSE TRIGGERED |
| ADAR |
BODY OUTSIDE DIAMETER |
0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
50.0 MILLIWATTS |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
T0-100 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| CQWX |
OUTPUT LOGIC FORM |
DIODE-TRANSISTOR LOGIC |
| AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| ADAU |
BODY HEIGHT |
0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| CQSJ |
INCLOSURE MATERIAL |
GLASS AND METAL |
| CZEQ |
TIME RATING PER CHACTERISTIC |
15.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
